Alloy Grade |
Brief Description |
Applications |
|---|---|---|
C5102 |
Sn content 5%; good strength, good corrosion resistance, and excellent workability. |
Suitable for high-performance electrical precision materials. |
| C5191 | Sn content 6%; high hardness characteristics. |
Suitable for electrical machinery materials, bonding terminals, IC components, etc. |
The above two grades have good ductility, fatigue resistance, and corrosion resistance. Applications: spring pieces for electronics and electrical appliances, switches, lead frames, connectors, diaphragms, bellows, and fuse clips, etc. |
||
C5210 |
Sn content 8%; good fatigue resistance and elastic properties. Characteristics: good ductility and corrosion resistance. | Suitable for switches, relays, and connectors used in communication, information, and measuring equipment. |
C2680 |
Good cold forgeability and good secondary processability. |
Suitable for mechanical parts and electrical parts. |
C1020 |
Good electrical and thermal conductivity and ductility; weldability, corrosion resistance, and weather resistance; does not become hydrogen embrittled by high-temperature heating in air. |
Applications: electrical parts and chemical industry uses, etc. |
C1100 |
Good electrical and thermal conductivity; good ductility, corrosion resistance, and weather resistance. |
Suitable for electrical parts and chemical industry uses, etc. |
Category |
UNS Number |
|---|---|
Copper |
C10100 ~ C15815 |
High-Copper Alloys |
C16200 ~ C19900 |
Cu-Zn Alloys (Brass) |
C21000 ~ C28000 |
Cu-Zn-Pb Alloys (Lead Brass) |
C31200 ~ C38500 |
Cu-Zn-Sn Alloys (Tin Brass) |
C40400 ~ C48600 |
Cu-Sn-P Alloys (Phosphor Bronze) |
C50100 ~ C52480 |
Cu-Sn-Pb-P Alloys (Lead-Containing Phosphor Bronze) |
C53400 ~ C54400 |
Category |
UNS Number |
|---|---|
Cu-P and Cu-Ag-P Alloys (Brazing Copper Alloys) |
C55180 ~ C55284 |
Cu-Al Alloys (Aluminum Bronze) |
C60800 ~ C64210 |
Cu-Si Alloys (Silicon Bronze) |
C64700 ~ C66100 |
Other Cu-Zn Alloys |
C66300 ~ C69710 |
Cu-Ni Alloys |
C70100 ~ C72950 |
Cu-Ni-Zn Alloys (Nickel Silver) |
C73500 ~ C79830 |
Cast Copper Alloys |
C80000 ~ C90000 |
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Ti |
|
|||
Balance |
≥99.5 |
|
|||
【Physical Properties】 |
||
|---|---|---|
Specific Gravity |
g/cm³ | 8.68 |
Electrical Conductivity |
%IACS |
13 |
Thermal Conductivity |
W/m·K |
50 |
Coefficient of Thermal Expansion |
10-6/K |
17.6 |
Modulus of Elasticity |
Gpa |
120 |
Stress Realxation (Remining Stress) Rate |
% |
95 |
【Mechanical Properties】 |
|||||||
|---|---|---|---|---|---|---|---|
Temper |
Tensile strength Mpa (N/m㎡) (Rm) |
Yield strength Mpa (N/m㎡) (Rp0.2) |
Elongation % |
Hardness HV |
Bendability 90∘ |
Thickness Range |
|
G/W |
B/W |
||||||
H |
920-1080 |
850-1000 |
10 |
300-340 |
0.0 |
0.5 |
≤0.15mm |
0.5 |
1.0 |
0.15-0.25 |
|||||
1.0 |
1.5 |
0.25-0.30 |
|||||
EH |
970-1100 |
900-1050 |
6 |
310-360 |
0.0 |
1.0 |
≤0.12mm |
1.0 |
2.0 |
0.12-0.22 |
|||||
1.0 |
2.5 |
0.22-0.3 |
|||||
SH |
1010-1200 |
950-1150 |
3 |
315-380 |
0.0 |
1.0 |
≥0.08mm |
1.0 |
2.0 |
0.08-0.10 |
|||||
1.0 |
1.0 |
0.10-0.20 |
|||||
ESH |
1050-1250 |
1000-1200 |
N/A |
320-400 |
1.0 |
2.0 |
≥0.08mm |
0.08-0.15 |
|||||||
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Cr |
Zr |
Si |
||
Balance |
0.2-0.4 |
0.07-0.13 |
0.01-0.03 |
||
【Physical Properties】 |
||
|---|---|---|
Specific Gravity |
g/cm³ | 8.9 |
Electrical Conductivity |
%IACS |
80 |
Thermal Conductivity |
cal/c㎡/㎝/sec/℃ 20℃ |
0.76 |
Coefficient of Thermal Expansion |
10-6/K |
17.1 |
Modulus of Elasticity |
Gpa |
137 |
Stress Realxation (Remining Stress) Rate |
% |
80 |
【Mechanical Properties】 |
|||||||
|---|---|---|---|---|---|---|---|
Temper |
Tensile strength Mpa (N/m㎡) (Rm) |
Yield strength Mpa (N/m㎡) (Rp0.2) |
Elongation % |
Hardness HV |
Bendability 90∘ |
||
G/W |
B/W |
||||||
1/2H |
470~550 |
350~510 |
6min |
135~160 |
0.5 |
0.5 |
|
H |
510~590 |
410~570 |
3min |
145~170 |
0.5 |
0.5 |
|
SH |
540min |
520min |
4min |
165min |
N/A |
N/A |
|
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Cr |
Zr |
OTHER |
||
Balance |
0.4-1.2% |
0.03-0.3% |
<0.2% |
||
【Physical Properties】 |
||
|---|---|---|
Specific Gravity |
g/cm³ | 8.9 |
Electrical Conductivity |
%IACS |
88 |
Thermal Conductivity |
W/m·K |
330 |
Coefficient of Thermal Expansion |
10-6/K |
18.6 |
Modulus of Elasticity |
Gpa |
137 |
Stress Realxation (Remining Stress) Rate |
% |
93 |
【Mechanical Properties】 |
|||||||
|---|---|---|---|---|---|---|---|
Temper |
Tensile strength Mpa (N/m㎡) (Rm) |
Yield strength Mpa (N/m㎡) (Rp0.2) |
Elongation % |
Hardness HV |
Bendability 90∘ |
||
G/W |
B/W |
||||||
R480 |
480-560 |
≧450 |
≧8 |
150-190 |
1.5 |
1.5 |
|
R540 |
540-630 |
≧500 |
≧4 |
160-200 |
2.0 |
2.0 |
|
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Sn |
Fe |
Ni |
Zn |
|
Balance |
0.10% |
<0.02 |
<0.02 |
<0.1 |
|
【Physical Properties】 |
||
|---|---|---|
Specific Gravity |
g/cm³ | 8.9 |
Electrical Conductivity |
%IACS |
83+ |
Thermal Conductivity |
W/m·K |
360 |
Coefficient of Thermal Expansion |
10-6/K |
17 |
Modulus of Elasticity |
Gpa |
128 |
Stress Realxation (Remining Stress) Rate |
% |
93 |
【Mechanical Properties】 |
|||||||
|---|---|---|---|---|---|---|---|
Temper |
Tensile strength Mpa (N/m㎡) (Rm) |
Yield strength Mpa (N/m㎡) (Rp0.2) |
Elongation % |
Hardness HV |
Bendability 90∘ |
||
G/W |
B/W |
||||||
H03 (R420) |
420-490 |
≧400 |
≧2 |
120-140 |
1 |
1 |
|
H04 (R460) |
460-560 |
≧410 |
≧2 |
135-155 |
1.5 |
1.5 |
|
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Ni |
Si |
P |
|
|
Balance |
0.8~1.8 |
0.15~0.3 |
0.01~0.05 |
|
|
【Physical Properties】 |
||
|---|---|---|
Specific Gravity |
g/cm³ | 8.9 |
Electrical Conductivity |
%IACS |
55 |
Thermal Conductivity |
W/m·K |
260 |
Coefficient of Thermal Expansion |
10-6/K |
16.8 |
Modulus of Elasticity |
Gpa |
135 |
Stress Realxation (Remining Stress) Rate |
% |
|
【Mechanical Properties】 |
|||||||
|---|---|---|---|---|---|---|---|
Temper |
Tensile strength Mpa (N/m㎡) (Rm) |
Yield strength Mpa (N/m㎡) (Rp0.2) |
Elongation % |
Hardness HV |
Bendability 90∘ |
||
G/W |
B/W |
||||||
R360 |
360~430 |
≧300 |
≧12 |
100~130 |
0.00 |
0.00 |
|
R410 |
410~470 |
≧360 |
≧10 |
125~155 |
0.00 |
0.00 |
|
R460 |
460~520 |
≧410 |
≧7 |
135~165 |
0.50 |
1.00 |
|
R520 |
520~580 |
≧460 |
≧5 |
145~175 |
1.00 |
1.50 |
|
R580 |
580~650 |
≧520 |
≧4 |
160~210 |
2.00 |
2.00 |
|
【Chemical Composition】 |
|||||
|---|---|---|---|---|---|
CU |
Ni |
Sn |
|
|
|
Balance |
9.00% |
6.00% |
|
|
|
【Physical Properties】 |
||
|---|---|---|
Electrical Conductivity |
6MS/m |
10 %IACS |
Thermal Conductivity |
54 W/(m·K) |
31 Btu·ft/(ft²·h·°F) |
Resistivity |
0.4 10-ᵌ/K |
0.2 10-ᵌ/°F |
Coefficient of Thermal Expansion |
17.3 10-6/K |
9.6 10̄ 6/°F |
Density |
8.89 g/cm³ |
0.321 lb/in³ |
Elastic Modulus |
130 Gpa |
18.800 ksi |
Specific Heat |
0.381 J/(g·k) |
0.091 Btu/(Ib·°F) |
Poisson's Ratio |
0.34 |
0.34 |
【Mechanical Properties】(values in parentheses are for reference only) |
|||||||
|---|---|---|---|---|---|---|---|
Condition |
Tensile Strength Rm MPa |
Ksi |
Yield Strength |
Ksi |
Elongation A50% |
Vickers Hardness HV |
|
TB00 |
420-520 |
61-75 |
≥180 |
≥26 |
≥15 |
(95-130) |
|
TH00 |
≥750 |
≥109 |
≥700 |
≥102 |
≥7 |
(260-330) |
|
TD02 |
600-700 |
87-102 |
≥550 |
≥80 |
≥3 |
(180-230) |
|
TH02 |
≥880 |
≥128 |
≥800 |
≥116 |
≥3 |
(280-340) |
|
TD04 |
675-775 |
98-112 |
≥600 |
≥87 |
≥1 |
(210-240) |
|
TH04 |
≥930 |
≥135 |
≥900 |
≥131 |
≥1 |
(300-350) |
|
【Mechanical Properties】Age-Hardened Condition at Factory Delivery (values in parentheses are for reference only) |
|||||||
|---|---|---|---|---|---|---|---|
Condition |
Tensile Strength Rm MPa |
Ksi |
Yield Strength Rp0.2 |
Ksi |
Elongation A50% |
Vickers Hardness HV |
|
TM00 |
600-840 |
87-122 |
≥500 |
≥73 |
≥10 |
(200-300) |
|
TM02 |
800-900 |
116-131 |
≥750 |
≥109 |
≥7 |
(260-300) |
|
TM04 |
850-950 |
123-138 |
≥800 |
≥116 |
≥3 |
(280-330) |
|
TM06 |
≥900 |
≥131 |
≥850 |
≥116 |
≥3 |
(≥310) |
|
The special characteristics of L96 Cu-Ni-Sn alloy are: very high strength and very good stress relaxation resistance, and it also has good formability. Typical applications are miniaturized signal connectors, spring pieces in mobile phones, and grounding contacts in consumer electronics and communication products. |
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