- High-Heat-Dissipation Aluminum Plate
- Performance
- Adhesion between Coating Layer and Material & Bendability
- Chemical Resistance and Damp-Heat Resistance of Coating Material
- Applications
High-Heat-Dissipation Aluminum Plate
Features
(1) Combines heat-dissipating particles with a high-thermal-conductivity resin to improve the aluminum plate’s heat dissipation.
(2) Extends the service life of electrical components, reduces equipment size, and saves energy.
(3) Surface insulating property; enhanced scratch resistance and multiple topcoat color options.
Performance
Adhesion between Coating Layer and Material & Bendability
Cross-Cut Adhesion Test Method:
1) Use a utility knife to perform cross-cutting on the surface of a 10×10 mm test specimen.
2) Firmly press adhesive tape onto the cut surface and then peel it off quickly.
Chemical Resistance and Damp-Heat Resistance of Coating Material
Applications
(1) Server chassis
(2) Large LCD back cover
(3) Frames/enclosures requiring heat dissipation, such as IC substrate heat sinks
(4) SSD case
(5) Other related product applications
